Ltcc Ceramic Package

They offer excellent resistance to the shock of drop testing and are well suited as module substrate materials in mobile communication devices.

Ltcc ceramic package.

2 3 low cost multilayer ceramic package for flip chip mmic up to w band. Ltcc substrate with embedded passive components. These fabrication technologies provide unique solutions for high interconnect density compact networks and high. It is sometimes referred to as glass ceramics because its composition consists of glass and aluminum.

High reliability ceramic substrates ltcc htcc. High lead count packages. Hermetic multilayer ceramic packages and substrates are ideal for more complex packaging solutions such as micro electronic mechanical systems mems and high frequency applications because such packages are hermetic and. The package structure includes a cavity for the flip chip mmic and improved coplanar feed through to suppress radiation.

A low cost multilayer low temperature co fired ceramic ltcc package based on a mass production design rule for an mmic up to w band has been developed. Our custom made ceramic leadless chip carriers are suited for applications that warrant a surface mounted low profile package having low inductance. Ausn eutectic process steps. Ceramic packages for power electronics.

Ceramic packages for automotive electronics. A plated ni or ni au coating on the accessible metal structures offers the possibility for high temperature brazing using e g. Neo tech has emerged as north america s leading manufacturer of quality low temperature co fired ceramic ltcc and high temperature co fired htcc substrates and packages. Ceramic packages and optical filters for image sensors.

For htcc a final metal coating e g. Components for fiber optic connectors. Ceramic packages for mems sensors. Package types multilayer technology provides 3 dimensional design flexibility for high performance requirements ceramic to metal htcc technology provides design freedom for ceramic feedthroughs in metal housings circular and rectangular the limitless design configurations provide the highest density hermetic packaging solutions available.

Htcc components generally consist of multilayers of alumina or zirconia with platinum tungsten and molymanganese metalization. The multilayer ceramic is co fired at high temperatures to form a solid and hermetic ceramic. Ltcc also features the ability to embed passive elements such as resistors capacitors and inductors into the ceramic package minimising the size of the completed module. Ceramic packages for light emitting diodes leds ltcc packages for rf modules.

Surface mount ceramic packages for electronic devices. Agcu eutectic or low temperature soldering e g. Kyocera s ltcc hard materials have a high flexural strength 400mpa that is equivalent to alumina ceramics. Optical packages htcc is a practical choice or optical applications packages due to hermeticity flatness capability and stable over a wide temperature range.